SMT & DIP coordination
Coordinate surface-mount, through-hole and subsequent assembly requirements around your board design.
Images from company materials. Illustrative applications; availability and specifications are confirmed for each project.
Scope & application
Review pads, packages, panelisation, component orientation and special process needs. Mixed-technology boards require an agreed process sequence and inspection plan. Production location, capability and lead time are confirmed for each project.
Before we begin
Prepare the application, indicative quantities, target schedule and available documentation to establish the scope and next steps.
Clarity at every step.
Design & PCB
Define functions, circuitry, board layout and mechanical interfaces before sampling.
BOM & materials
Review part numbers, availability and substitution rules; coordinate PCB fabrication and sourcing.
SMT & DIP
Connect surface-mount, through-hole and soldering processes with board-specific inspection requirements.
Test & delivery
Plan functional testing, ageing, conformal coating, final assembly and outgoing checks as required.
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